The SIGNAL PROBE SOCKET is a development assistance FBGA IC socket for FPGA/PLD, which possesses an epochal structure and performance.
It is developed with the joint technologies of SER Corporation’s Super Micro Contact Technology and SK Electronics’ Advanced Process Wiring Technology.

The FFP1152-S2-II brings good news as a development assistance product for PLD/FPGA Engineers and Embedded System Development Engineers.
The FBGA LSI terminal signal can be measured directly from under the device.

At this time, the Signal Probe Socket is designed for Xilinx FPGA Virtex-II FF1152.
It features are the system debug at the application and circuit development, drastically shorten the development terms for the evaluation analysis and better promotional efficiency of the operations. FFP1152-S2-II actualizes the fulfillment of development cost reduction and high convenience.
These are the basic benefits you can expect from the technology development.

When your engineers are faced with the troubles that arises from the differences between his design plan and the actual happenings on the PCBs (ex. doubt movement and phenomenon, distrust movement and mounting).
The solutions to these troubles are to do a sequence of LSI contact terminal movement and detail measurement of the time and the waves.
You can measure the LSI terminal lead with the 50Ω characteristic impedance signal line by the SIGNAL PROBE SOCKET.
It provides reliable wave measurement that is required at the development/evaluation stages and clears the “engineering-skill” walls your engineers may have.

FFP1152-S2-II is structured by Solder-less IC Test Socket and FBGA/Signal Probe with 1.00mm pitch,1152 probe terminal, 35mm x 35mm matrix penetrated printed circuit board.
The signal probe board’s inner layer wire is processed in 60μm width, each line ground guarded.
All of the BGA IC matrix signal terminals are lined with the 50Ω characteristic impedance to outer around the board and aligned 2.54 pitches as the wave measurable terminals. (Applying for Patent)

Instructions:
Load the SIGNAL PROBE SOCKET (FFP1152-S2-II) over the main PCB and load the package (FF1152) into the socket (Photo-2).
The system developers and Virtex-II FF1152 circuit developers can evaluate, inspect and analyze the circuit when the IC signals are being measure directly under the board.

Due to the trend of FPGA/PLD are high-density, high-speed and higher contact count pin.
Especially, the high frequency characteristic Signal Probe Socket is required to demand of BGA/FPGA IC Packages.
FFP1152-S2-II is the first product and we will continue, with Xilinx’s cooperation, to develop the SIGNAL PROBE SOCKET family.

The retail price of FFP1152-S2-II is $4,100/pc.
The initial selling target is 1,000pcs.

For questions regarding this product, please contact:

Photo 1: FFP1152-S2-II


Photo 2: FFP1152-S2-II loaded on PCB

SER Electronics
Masamoto (Masa) Taira
Tel: 925-746-7166 Fax: 925-746-7153
Email: mtaira@serusa.com

For product information, please contact Masamoto Taira of S.E.R. USA.
S.E.R. is the best product deliver of the customized sockets & connectors industry.