FPGA/CPLD Support, Evaluation and Debugging SL IC Socket.

1. Description
2. Product features
3. Product Applications
4. Cross Reference Table for Package Type vs. IC Socket.
5. How to use the socket
6. Notice for PCB pattern designs
7. PCB Layout Drawings by Packages
8. Base Socket's Drawing.
9. Repairs and Maintenance of Socket
10. Socket Part Number Designation

1. Products Description

SER's SL IC sockets (Solder-less IC socket) of BG, FG and CS series are applicable with the Xilinx Virtex-E package series, Altera Apex20k package series, Actel ProASIC package series, Quicklogic QuickDSP package series and Lattice isp package series of BGA (1.27mm pitch), FBGA (1.00mm pitch) and CSP (0.8mm pitch) packages.

For the development and design of FPGA/CPLD, these SL IC sockets are the most suitable for system performance evaluations and functional verification when you build the systems.
We use our original double mini-probe for the contact that is ideal to the contact technology specifications with signal high speed of over GHz (>3GHz), high densities of circuit wiring (includes 0.5mm pitch matrix wiring), and multiple contact balls (over 2,000 contact balls).

The socket is composed of, 1) Base socket & 2) Cap (lid) for pressing IC.
The Base socket is mounted and fixed on the PCB through holes with four screws (M2) or with recommended mount pins.
IC is loaded into the socket cavity and fixed by the Cap.

There are two mounting methods for the base socket, the SCREW MOUNT method and the PIN MOUNT method.
The PCB designer can choose upon his applications.

The socket contact between IC and PCB is a spring loaded Double Mini-Probe.
By its characteristic, the socket does not need to be soldered onto the PCB.
The socket can be used for both development and production of PCB and its use is practical and economical, for it can be reloaded, reused, and repaired.

2. FEATURES

• No soldering required for mounting on to PCB
• Choice of Screw mount or Pin mount method
• Over 2GHz high frequency performance and high reliable contact resistance as 65mΩ.
• Socket can be common used, repaired, reloaded and reused
• Corresponds to all the 1.27, 1.0, and 0.8mm pitch package sizes

3. APPLICATION

• FPGA/CPLD design evaluation, functional evaluation, circuit development evaluation and verification.
• Field defective verification, analysis and repair
• LSI and System performance and function test
• For sample IC test and inspection

4. Cross Reference Table for Package Type vs. IC Socket.

• XILINX (Cross Table)
• ALTERA (Cross Table)
• ACTEL (Cross Table)
• QUICKLOGIC (Cross Table)
• LATTICE (Cross Table)

5. How to use the socket

There are two methods the socket can be mounted S: Screw mount method, P: Pin mount method.
When you design the circuit board and according to your application, you have a choice of either one.

S: Screw Mount Method:

As shown in Fig-3(172KB); Fix the four points of the base socket on to the PCB with screws and nuts (basically M2).
It is easy to load and unload, reliable for operation and is the standard method.

P: Pin Mount Method:

As shown in Fig-1 (17KB); Fix the four points of the base socket on to the PCB and solder the pins or washer plates. This method requires only four 0.9mm diameter through holes on the PCB to mount the socket.
It is most ideal for high-density, higher count pins of circuit pattern requirements and it self-aligns.
When you accept this method, it is important that there be no gap between the bottom side of the socket and PCB and contact pins should be zero pressure.

　　Fig.2-1 : Screw Cap Type.
　　Example) FG1156-S2 　　　Screw Mount (Screw Cap) (111KB)

　　Fig.2-2 : One Touch Cap Type.
　　Example) BG560-S1 　　　One Touch Mount (One Touch Cap) (83KB)

6. Notice for PCB pattern designs

To design common use of PCB for mounting the SL IC Socket and IC, the followings are needed.

1. Refer the Figure PCB layout drawings.
2. Footprint pattern on the PCB should be the same alignment as IC matrix and the land size should be according to direct mount IC designed rules.
3. Avoid the through holes in the middle area on the PCB land pattern.
4. The PCB should be thicker than 1.6mm. Due to the balance of the number of pins, contact pressure and PCB thickness, reconsideration is needed for ICs over 676 contacts and PCB thickness less than 1.6mm. There is a possibility of a PCB patterning problem if PCB thickness is less than 1.6mm and/or ICs more than 1,000 contact pins.
5. GND plane is recommended for the four through holes on both Screw Mount and Pin Mount Methods. It can resist the static electricity. However, avoid GND plane if the IC package has different electric potential.
6. Basically, it is prohibited to mount the other components on the socket mounting area. Regarding the backside of the PCB, there are no limitations except around the four through holes.

7. PCB Layout Drawings by Packages

• Among the IC packages and SL IC sockets, there are four standard sizes.
• The four package sizes are 27x27, 35x35, 40x40 and 45x45.
• In accordance with the package contact pitches, the socket size series are BGA, FBGA, and CSP.
• Every layout is according to this standard package layout.
• Select the through hole diameter and alignment by the methods.
• Prohibit to mounting any other parts on to the socket outer shape expressed area on the drawing.
  XILINX， 　 　　ALTERA， 　 　　ACTEL， 　 　　QUICKLOGIC 　 　　LATTICE

8. Base Socket Drawing.


　　Fig.3 SL IC Base Socket Drawing.Example. FC672-S1(-S2 Common use). 　　 Drawing Detail. (172KB)

• FC672 Base Socket Concept.
• For Package Size 27x27mm.
• Selectable from 4-size type of socket.

9. Repair and Maintenance of Socket

SL IC socket can be repair in the many cases depending upon the damage and abrasion of contact tip.
Maintenance is effective to keep recovery and good contact characteristic for reuse the socket.

1. Socket repair:
   User can replace Double Mini-Probe easily because the socket structural is simple.
   The repair and maintenance parts are available.
   However, some works require minute and precision skills.
   Charged repair is available at SER.
   　
2. Cleaning and Maintenance of socket:
   The duration of the socket is possible to extend the life of Double Mini-Probe insertion up to the ten thousands or more (depending on usage environment) by cleaning the socket body and contact tips.
   Either uses the cleaning kit or a hard bristle type toothbrush (cut bristles 5mm in height) and brush the probe tips inside the socket very well.
   Then air-blow the dust from the abrasion.
   By eliminating this accumulation of dust, the cause of contact inferiority can be prevented.

10. Socket Part Number Designation

To designate the socket part number, the name of IC maker, type and number of contact are needed.
A: IC maker.,B: Package Type.,C: Number of Contact.,D: Mount Selection.,E: Cap type.

Example)
XILINX FG 1156 - S 2　

     A       B      C         D  E 

A: FPGA/CPLD Maker

XILINX: Xilinx

ALTERA: Altera

ACTEL: Actel

QUICK: Quicklogic

B: Package Variation

BG: BGA 1.27mm pitch socket. (Actel, Xilinx) 　 　

BC: BGA 1.27mm pitch socket. (Altera) 　

PB: BGA 1.27mm pitch socket. (Quicklogic) 　 　

FG: F-BGA 1.0mm pitch socket. (Actel, Xilinx) 　 　

FC: F-BGA 1.0mm pitch socket. (Altera) 　 　

PS: F-BGA 1.0mm pitch socket. (Quicklogic) 　 　

CS: CSP 0.8mm pitch socket. (Xilinx)

C: Number of Pin

1156: Total number of IC's contacts or socket pin number.

D: Socket mount type

S: Screw mount type. 　 　

P: Pin mount type.

E: CAP

0: No Cap. 　 　

1: One touch Cap. 　 　

2: Screw Cap. 　 　

3: Special.

Contact to SER